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Micro-package Device
- Micro-Encapsulated Phase-Locked Source Modules
- DDS Mixing Frequency Source Module
- C-Band Four-Channel Up-Conversion Module
- S-Band Transceiver Duplex Module
- S-Band Up-Conversion Module
- S-Band Down-Conversion Module
- AGC Automatic Gain Control Module
- S-Band Receiver Front-End Module
- IF Amplification And Attenation Module
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RF Module/Component
- Ku-Band Dual-Loop Hybrid Frequency Source Module
- C-Band Multi-Channel Frequency Source Module
- Miniaturized DDS Frequency Hopping Local Oscillator Module
- 0.03~3GHz Variable Frequency Module
- 0.38-18GHz Ultra Wideband Dual Channel Receiver Assembly
- 2-18GHz Miniaturised Ultra Wideband Transceiver Components
- Ka-Band Miniaturized Broadband Transceiver Assembly
- C-band Transceiver All-in-One
- Ku-Band Transceiver Assembly
- S-Band 100W Power Amplifier Assembly
- V-Band Transceiver Assembly
- C-Band Microwave Combination
- 6~18GHz Variable Frequency Components
- 30MHz~3GHz Down-Conversion Components
- UHF Band RF Front-End Components
- C-Band RF Front-End Components
- Multichannel Phased Array Front-End T/R Assembly
- L-band T/R Assembly
- X-band T/R Assembly
- Ka-band T/R Assembly
- Ka-Band 64-Array Tile Phsed Array Antenna
- S-Band 16-Array Tile Phased Array Antenna
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