RF Module/Component

Product Classification

Ku-Band Dual-Loop Hybrid Frequency Source Module C-Band Multi-Channel Frequency Source Module Miniaturized DDS Frequency Hopping Local Oscillator Module 0.03~3GHz Variable Frequency Module 0.38-18GHz Ultra Wideband Dual Channel Receiver Assembly 2-18GHz Miniaturised Ultra Wideband Transceiver Components Ka-Band Miniaturized Broadband Transceiver Assembly C-band Transceiver All-in-One Ku-Band Transceiver Assembly S-Band 100W Power Amplifier Assembly V-Band Transceiver Assembly C-Band Microwave Combination 6~18GHz Variable Frequency Components 30MHz~3GHz Down-Conversion Components UHF Band RF Front-End Components C-Band RF Front-End Components Multichannel Phased Array Front-End T/R Assembly L-band T/R Assembly X-band T/R Assembly Ka-band T/R Assembly Ka-Band 64-Array Tile Phsed Array Antenna S-Band 16-Array Tile Phased Array Antenna

Ku-Band Dual-Loop Hybrid Frequency Source Module

The product is a miniaturized Ku-band dual-channel frequency hopping source. Channel one adopts a double-loop frequency combination to achieve frequency output, the channel phase noise and spurious index is good; Channel two uses a single-loop to achieve the frequency output. The product has a high degree of integration, small size, light weight, good air-tightness, reliability, etc. The power supply adopts a single +5V power supply.

C-Band Multi-Channel Frequency Source Module

The product is built with a nationally produced phase locked loop chip, power management chip, digital processing chip and 100MHz crystal, featuring low power consumption, low phase noise, low spurious and high isolation.

Miniaturized DDS Frequency Hopping Local Oscillator Module

The module has an internal DDS driven PLL output for the required frequency, which can be switched between the two DDS outputs for fast jumping between frequencies. The internal FPGA is integrated and the control interface is SPI, RS422 level. The module size is 45mm*38mm*12mm.

0.03~3GHz Variable Frequency Module

0.38-18GHz Ultra Wideband Dual Channel Receiver Assembly

The component realizes the phase reference reception of two RF signals from 0.38MHz to 18GHz, and outputs two IF signals after pre-selection filtering, down-conversion, IF filtering, amplification and down-mixing. It has high integration and 3U VPX standard size.

2-18GHz Miniaturised Ultra Wideband Transceiver Components

The receiver channel of this component amplifies the incoming RF signal, sorts the filter and detects it. The receiver channel of the assembly amplifies the incoming RF signal, sorts it into filter groups, detects the waveform and, after a secondary down-conversion, achieves an IF output. The transmitter channel takes the incoming IF signal, up-converts it twice and then passes it through a binning filter bank and amplifies it. The RF output is achieved.

Ka-Band Miniaturized Broadband Transceiver Assembly

The receive channel of this component amplifies the input RF signal, sorts the filter bank, detects the waveform, and then achieves the IF output through secondary down-conversion. The transmitter channel takes the incoming IF signal and then passes it through a binning filter set and amplification to achieve the RF output.

C-band Transceiver All-in-One

The transmitting channel is mainly composed of the receiving channel and the transmitting channel. The transmitter channel mainly performs the functions of filtering, amplifying, up-converting, filtering, driving and amplifying, power amplifying, filtering and outputting the low frequency signal. amplification, power amplification, filtering, output and other functions. The receive channel mainly implements the input RF signal down-conversion, filtering, AGC gain dynamic control, etc. The receiver and transmitter are equipped with separate local oscillators.

Ku-Band Transceiver Assembly

The channel is mainly made up of functional modules such as frequency synthesis, 1-way up-conversion and 2-way down-conversion. Frequency converter module: including and branch frequency converter module and differential branch frequency converter module, where the and-branch frequency converter includes two channels of up-conversion and down-conversion; the differential branch frequency converter is 1 channel of down-conversion.

S-Band 100W Power Amplifier Assembly

The amplifier module is equipped with operating/silent function, high/low power control function, enable state control, temperature information, operating current information, output power information reporting, etc.

V-Band Transceiver Assembly

Each module consists of 2 receive/transmit channels, each of which is connected to the antenna at the RF end of the transmit channel, as shown in the diagram. The module must be equipped with power fault status reporting, temperature detection reporting, lockout indication reporting, etc.

C-Band Microwave Combination

Each module consists of 1 receive/1 transmit channel as shown in the diagram. The module must be equipped with power fault status reporting, temperature detection reporting, lockout indication reporting, etc.

6~18GHz Variable Frequency Components

30MHz~3GHz Down-Conversion Components

The down-converter module receives 30MHz ~ 3GHz RF signals mixed and filtered to amplify the output 720MHz/140MHz, its main function is to complete the function of the input signal to the IF signal.

UHF Band RF Front-End Components

Low noise amplification and filtering of the UHF band uplink signal, filtering and amplifying the downlink signal; transmitting and receiving at the same frequency and time division. The UHF downlink RF channel defaults to a low power, working state after power-up, with a level output of 19dBm ~ 24dBm (0dBm input to the downlink RF port).

C-Band RF Front-End Components

The C-band uplink signal received by the antenna is amplified, filtered and sent to the uplink receiving equipment; the downlink signal is filtered, amplified and sent to the antenna to transmit to the ground; the signals of the transmitting and receiving channels are isolated by a duplexer, and the three antennas are switched on in time by an RF switch. The default state of the C downlink RF channel after power up is low power, working state, level output 20dBm~25dBm (downlink RF port 0dBm input), the RF channel after power up is connected to the C roof omnidirectional antenna by default.

Multichannel Phased Array Front-End T/R Assembly

The S-band transceiver assembly consists of 3 transceiver channels, a beam synthesis network, a calibration synthesis network, a power supply module and a monitoring module. The transceiver channel consists of a circulator, limiter, low noise amplifier, filter, amplifier, transceiver switch and CNC amplitude phaser.

L-band T/R Assembly

Each module consists of receive channels and 4 transmit channels, as shown in the figure.

X-band T/R Assembly

The product consists of a receiver channel, a transmitter channel, a local oscillator module and a power control module.

Ka-band T/R Assembly

Each module consists of 3 receive/transmit channels and 2 frequency channels, each of which is connected to the antenna at the RF end. The module must be equipped with power fault status reporting, temperature detection reporting, and load status reporting within the module.

Ka-Band 64-Array Tile Phsed Array Antenna

Tile structure with circuits and chips arranged horizontally parallel to the array surface for a compact and highly integrated array.

S-Band 16-Array Tile Phased Array Antenna

Each transceiver channel is implemented using a self-developed device level S-band transceiver duplex module, with an array antenna on the upper surface of the substrate, 16 transceiver channels and digital acquisition and processing circuitry on the lower surface, and a transceiver beam synthesis network integrated inside the substrate. The new ultra-low profile phased array is only 1/10th of the size and weight of existing products of the same function.