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一级标题
一级标题
Dielectric Filter
LC Filter
Filter Module
Metal Cavity Filter
Microwave Components
Micro-package Device
RF Module/Component

Micro-package Device

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Micro-package Device
Product Classification
Micro-Encapsulated Phase-Locked Source Modules DDS Mixing Frequency Source Module C-Band Four-Channel Up-Conversion Module S-Band Transceiver Duplex Module S-Band Up-Conversion Module S-Band Down-Conversion Module AGC Automatic Gain Control Module S-Band Receiver Front-End Module IF Amplification And Attenation Module
DDS Mixing Frequency Source Module
DDS Mixing Frequency Source Module
Based on the HTCC substrate's ceramic sealing process, the product can achieve fast frequency hopping from L-band to Ku-band. The product is a surface mount package.
C-Band Four-Channel Up-Conversion Module
C-Band Four-Channel Up-Conversion Module
Based on the HTCC substrate's ceramic sealing process, the internal integrated local oscillator source, up-conversion, through the switching for 4-way channel selection. The product is a surface mount package, easy to use.
S-Band Transceiver Duplex Module
S-Band Transceiver Duplex Module
Based on the HTCC substrate's ceramic sealing process, the product realizes S-band transceiver duplex function. The product is a surface mount package, easy to use.
S-Band Up-Conversion Module
S-Band Up-Conversion Module
Based on the HTCC substrate's ceramic sealing process, the product achieves up-conversion of IF signals function. The product is a surface mount package, easy to use.
S-Band Down-Conversion Module
S-Band Down-Conversion Module
Based on the HTCC substrate's ceramic sealing process, the product realizes the RF signal down-conversion function.The product is a surface mount package, easy to use.
AGC Automatic Gain Control Module
AGC Automatic Gain Control Module
Based on the HTCC substrate's ceramic sealing process, the entire AGC channel consists of two main package modules, which are connected by an external frequency selection filter. The product is a surface mount package, easy to use.
S-Band Receiver Front-End Module
S-Band Receiver Front-End Module
The product integrates 4-sage amplifier, 2-stage filter and temperature complementary attenuation, etc. The product is a surface mount package, easy to use.
IF Amplification And Attenation Module
IF Amplification And Attenation Module
Based on the HTCC substrate's ceramic sealing process, the product can realize the function of amplification and attenuation of IF. The product is a surface mount package, easy to use.